HP-GM100-7 Two-Component Potting Machine | Precision 2K Adhesive Dispensing & Encapsulation System

The HP-GM100-7 Two-Component Potting Machine is a high-precision automated dispensing and encapsulation system designed for 2K adhesive mixing, potting, sealing, bonding, and electronic component protection.

Built around a rigid three-axis servo motion platform, the system combines accurate material metering, programmable dispensing paths, vacuum-assisted material degassing, and flexible mixing ratio control to provide stable and repeatable results across a wide range of industrial applications.

From automotive electronics and power electronics to EV battery components, sensors, control modules, and industrial electronics, the HP-GM100-7 provides a reliable solution for manufacturers looking to replace manual potting and improve process consistency, material utilization, and production efficiency.

Two-component adhesives and resins can be challenging to process because of their different viscosities, mixing characteristics, curing behavior, and sensitivity to air entrapment.

The HP-GM100-7 integrates the key stages of the dispensing process into one automated platform:

Material Storage → Vacuum Degassing → Precision Metering → Ratio Control → Dynamic/Static Mixing → Programmable Dispensing → Encapsulation

This integrated architecture helps manufacturers achieve more consistent potting volume, mixing ratio, bead placement, and material coverage while reducing dependence on manual operations.

The dispensing system supports configurable mixing ratios from 1:1 to 10:1, with extended ratios available according to material and application requirements.

Different metering technologies, including:

• Servo-driven screw pump
• Gear pump
• Piston pump

can be configured according to adhesive viscosity, filler content, flow requirements, and process characteristics.

This makes the machine suitable for a wide range of epoxy, polyurethane, silicone, thermal conductive, and other two-component materials.

The HP-GM100-7 is engineered for repeatable material delivery with:

• Dispensing output: 0.2 - 30 g/s
• Ratio and shot accuracy: ± 2% at 100 g shot size
• Processable viscosity: up to 50,000 cps

Accurate material metering helps minimize over-dispensing, reduce material waste, and maintain consistent product quality during continuous production.

For manufacturers processing expensive electronic encapsulation materials, precise shot control can directly contribute to lower material consumption and improved production yield.

Air bubbles and voids inside electronic potting materials can negatively affect insulation, thermal performance, mechanical protection, and long-term reliability.

The HP-GM100-7 incorporates an integrated vacuum degassing system with an ultimate vacuum level of approximately 0.2 - 0.3 kPa (2-3 mbar).

The system can remove entrapped air from the material before dispensing and maintain a negative-pressure material environment to help achieve low-void and bubble-free potting.

This is particularly valuable for:

• Power electronics encapsulation
• IGBT and SiC module potting
• Automotive ECU protection
• Sensor encapsulation
• Battery electronics
• Outdoor electronic assemblies

A rigid industrial frame combined with servo-driven linear motion provides stable and repeatable positioning during dispensing.

• X/Y movement: up to 500 mm/s
• Z movement: up to 300 mm/s
• Repeat positioning accuracy: ±0.02 mm

The effective working area can reach 700 × 700 mm, with up to 300 mm component height clearance.

The programmable 3-axis platform supports precise material deposition around components, housings, connectors, PCB assemblies, and irregular product geometries.

The proprietary control software supports flexible path programming for different product geometries.

Operators can create:

• Point dispensing
• Straight lines
• Circles
• Arcs
• Continuous beads
• Complex 3D dispensing paths

The same platform can therefore be configured for potting, encapsulation, dam-and-fill, sealing, bonding, gasketing, and selective adhesive dispensing.

On-site teach pendant programming and PC-based offline programming are both available, helping manufacturers shorten changeover time when multiple product models are processed.

The HP-GM100-7 supports interchangeable material reservoirs in:

10 L / 30 L / 40 L / 60 L

A separate 2 L solvent/cleaning tank is also available for material-path cleaning and maintenance.

Material loading can be performed through:

• Vacuum suction
• Manual filling

Optional tank heating can be added for high-viscosity or highly filled materials to improve material flow and pumpability.

For materials that may settle during storage or production, an optional tank agitator can maintain better material uniformity.

Not all potting materials behave in the same way. Some applications require low-viscosity self-leveling materials, while others use highly filled compounds containing thermal or functional fillers.

The HP-GM100-7 is designed to accommodate both types of materials through configurable:

• Pumping systems
• Mixing systems
• Tank configurations
• Heating functions
• Agitation systems
• Dispensing valves

The system can process materials with viscosities of up to 50,000 cps, making it suitable for demanding electronic potting and liquid adhesive dispensing applications.

For reactive two-component materials, material curing inside the dispensing valve, mixer, or tubing can lead to downtime and maintenance problems.

The HP-GM100-7 incorporates an automatic idle-time anti-curing function to help protect the material delivery system during production interruptions.

A solvent-based automatic or manual flushing system can also be configured to simplify cleaning and material changeover.

These functions help reduce:

• Nozzle blockage
• Mixer replacement frequency
• Material waste
• Cleaning time
• Unplanned downtime

For applications requiring higher throughput, the HP-GM100-7 can support multiple dispensing and mixing heads.

Multiple heads can be configured for simultaneous processing or different dispensing operations, making the platform suitable for short-cycle-time production and automated potting cells.

The machine can also communicate with external production equipment through I/O and Ethernet interfaces, providing an interface for factory automation and Industry 4.0 integration.

The HP-GM100-7 can be customized according to production requirements.

Available options include:

• MES communication interface
• In-line weighing module
• Real-time material level monitoring
• Automatic tank agitator
• Tank heating
• Vibration table
• Safety light curtain
• Vision alignment system
• AOI / dispensing inspection
• Extended mixing and dispensing configurations

These options allow the machine to evolve from a standalone potting machine into a more comprehensive automated adhesive dispensing and encapsulation workstation.

Different adhesives require different dispensing parameters. Before equipment selection and final process approval, Haipai provides in-house laboratory testing and sample trials to evaluate material behavior, mixing ratio, dispensing volume, flow characteristics, degassing requirements, and curing performance.

This allows customers to validate the dispensing process on their actual products and materials before moving toward equipment implementation.

For customized applications, the HP-GM100-7 can be configured according to:

Product Geometry + Material Characteristics + Mixing Ratio + Dispensing Volume + Cycle Time + Production Automation Requirements

Whether you need electronic potting, PCB encapsulation, adhesive dispensing, dam-and-fill, liquid gasketing, sealing, or component bonding, the HP-GM100-7 can be configured around your specific material and production requirements.

Send us your product samples, adhesive information, dispensing requirements, and target production volume. Haipai can evaluate the process and recommend a suitable 2K dispensing and potting solution.