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200Pa Ultimate Vacuum Online Glue Potting Machine Bubble Free HP-VP450

Product Details

Place of Origin: China

Brand Name: Haipai

Certification: CE,ISO9001

Model Number: HP-VP450

Payment & Shipping Terms

Minimum Order Quantity: 1 unit

Packaging Details: Wooden case with vacuum package inside

Delivery Time: 30 working days

Payment Terms: T/T

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Glue Potting Machine 200Pa

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Online Glue Potting Machine

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Vacuum Potting Machine Bubble Free

Vacuum Potting Environment:
200Pa (2mbar) Ultimate Vacuum Eliminates Bubbles And Voids For Perfect Encapsulation
Precision Dispensing:
±2% Dispensing Accuracy (based On 10g Benchmark) For Consistent Material Volume
High Viscosity Capability:
Handles Materials Up To 100,000cP Operational Viscosity
Flexible Mixing Ratio:
Adjustable From 100:100 To 100:20 Or 100:20 To 100:10 For Two-part Material Systems
Dual Dispensing Speed Options:
Choose 1g/s~15g/s Or 5g/s~30g/s Based On Application Needs
Anti-Curing Function:
Prevents Material Hardening In Mixing Head During Pauses
Automatic Cleaning:
Fully Automatic Draining/cleaning For Easy Material Changeover
SMEMA Line Integration:
Standard Interface For Seamless Communication In Automated SMT Lines
Vacuum Potting Environment:
200Pa (2mbar) Ultimate Vacuum Eliminates Bubbles And Voids For Perfect Encapsulation
Precision Dispensing:
±2% Dispensing Accuracy (based On 10g Benchmark) For Consistent Material Volume
High Viscosity Capability:
Handles Materials Up To 100,000cP Operational Viscosity
Flexible Mixing Ratio:
Adjustable From 100:100 To 100:20 Or 100:20 To 100:10 For Two-part Material Systems
Dual Dispensing Speed Options:
Choose 1g/s~15g/s Or 5g/s~30g/s Based On Application Needs
Anti-Curing Function:
Prevents Material Hardening In Mixing Head During Pauses
Automatic Cleaning:
Fully Automatic Draining/cleaning For Easy Material Changeover
SMEMA Line Integration:
Standard Interface For Seamless Communication In Automated SMT Lines
200Pa Ultimate Vacuum Online Glue Potting Machine Bubble Free HP-VP450
HP-VP450 Online Vacuum Glue Potting Machine 200Pa Ultimate Vacuum for Bubble-Free Potting
HP-VP450 Vacuum Glue Potting Machine 400*400*100mm Working Range, ±2% Dispensing Accuracy, 200Pa Ultimate Vacuum for Bubble-Free Potting
Product Overview
The HP-VP450 Vacuum Glue Potting Machine is a high-precision potting system designed for applications requiring bubble-free encapsulation of electronic components. By performing the dispensing process inside a vacuum chamber, this machine eliminates trapped air and voids that can compromise the insulation and protection performance of potted assemblies.
The vacuum chamber achieves an ultimate vacuum of 200Pa (2mbar), ensuring that air is thoroughly removed from both the material and the component cavities before and during dispensing. The single-head working range of 400mm * 400mm * 100mm accommodates a wide variety of PCB sizes and component heights. Motion control is handled by a servo motor + ball screw drive, delivering smooth, precise positioning with motion speeds up to 500mm/s on X-Y axes and 200mm/s on Z-axis.
The fluid system handles materials with operational viscosity up to 100,000cP, making it suitable for a broad range of potting compounds including epoxies, silicones, and polyurethanes. Mixing ratio is adjustable from 100:100 to 100:20 or 100:20 to 100:10, providing flexibility for different two-part material systems. Dispensing accuracy of ±2% (based on 10g benchmark) ensures consistent material volume for each product. Glue dispensing speed can be selected between 1g/s~15g/s or 5g/s~30g/s depending on application requirements. Metering is accomplished via stepper motor + gear pump or screw pump for precise volumetric control.
The anti-curing function prevents material from hardening inside the mixing head during production pauses, while the fully automatic cleaning function simplifies changeover between different material types or at the end of production shifts. The system is controlled by an industrial PC with monitor and motion control card, with simple start switch operation for ease of use. The SMEMA interface enables seamless integration into automated SMT lines.
Technical Specifications
Parameter Specification
Model HP-VP450
Machine Dimensions L2900*W1520*H2000mm
Weight Approx. 1000KG
Control System Industrial PC + Monitor + Motion Control Card
Operation Method Start switch
Single-Head Working Range 400mm (X) * 400mm (Y) * 100mm (Z)
Motion Speed (X-Y) 0-500mm/s
Motion Speed (Z) 0-200mm/s
Drive Method Servo motor + ball screw
Operational Viscosity Up to 100,000cP
Dispensing Accuracy ±2% (based on 10g benchmark)
Mixing Ratio (Option 1) 100:100 to 100:20 adjustable
Mixing Ratio (Option 2) 100:20 to 100:10 adjustable
Glue Dispensing Speed (Option 1) 1g/s ~ 15g/s
Glue Dispensing Speed (Option 2) 5g/s ~ 30g/s
Metering Method Stepper motor + gear pump / screw pump
Anti-Curing Function Available
Cleaning Function Fully automatic draining
Vacuum Chamber Ultimate Vacuum 200Pa (2mbar)
Power AC220V 50Hz, 8.5KW
Interface SMEMA
Working Environment Temperature: 0-40°C, Humidity: 20-90%
Key Features
  • Vacuum Potting Environment: 200Pa (2mbar) ultimate vacuum eliminates bubbles and voids for perfect encapsulation
  • Precision Dispensing: ±2% dispensing accuracy (based on 10g benchmark) for consistent material volume
  • High Viscosity Capability: Handles materials up to 100,000cP operational viscosity
  • Flexible Mixing Ratio: Adjustable from 100:100 to 100:20 or 100:20 to 100:10 for two-part material systems
  • Dual Dispensing Speed Options: Choose 1g/s~15g/s or 5g/s~30g/s based on application needs
  • High-Precision Motion: Servo motor + ball screw drive with smooth, accurate positioning
  • Generous Working Range: 400*400*100mm single-head coverage for diverse PCB sizes
  • Anti-Curing Function: Prevents material hardening during production pauses
  • Automatic Cleaning: Fully automatic draining/cleaning function for easy changeover
  • Simple Operation: Start switch control with industrial PC + monitor interface
  • SMEMA Integration: Standard interface for automated line communication
Applications
  • Power electronics potting (IGBT modules, power supplies)
  • Automotive electronics encapsulation (ECUs, sensors, lighting modules)
  • LED driver and lighting module potting
  • Medical device encapsulation requiring bubble-free protection
  • Industrial control system potting
  • New energy vehicle battery management systems (BMS)
  • Transformer and coil encapsulation
  • Any application requiring void-free component protection