HP-D30-A Precision Glue Dispenser| Robot for SMT Assembly, Underfill, PCB Manufacturing

Overview

The HP-D30-A High-Speed Dispensing Machine is a precision fluid dispensing solution engineered for high-volume SMT assembly, semiconductor packaging, and electronics manufacturing. Built on a rigid cast-iron frame with linear motor-driven X/Y axes and servo-driven Z-axis, this automatic glue dispenser delivers ±0.01mm repeat accuracy at speeds up to 1500mm/s – meeting the demands of high-throughput production environments. Designed for seamless inline integration, the HP-D30-A supports SMEMA communication protocols and offers a 450×460mm dispensing area with a maximum component height of 50mm. Whether you're applying underfill, conformal coating, dam-and-fill, FPC reinforcement, or SMT adhesive bonding, this high-precision dispensing robot adapts to your application with piezoelectric or screw valve configurations.

Key Features

High-Speed, High-Precision Motion System – The HP-D30-A features linear motors paired with optical encoders on the X and Y axes, delivering ultra-smooth and precise motion with a repeat positioning accuracy of ±0.01mm to ensure consistent glue deposit placement. The system achieves maximum speeds of 1500mm/s on the X/Y axes and 300mm/s on the Z axis, significantly reducing cycle times and boosting overall throughput. The cast-iron frame construction effectively absorbs vibration, maintaining accuracy and stability even during prolonged high-speed operation.

Versatile Dispensing Capabilities – This platform supports both piezoelectric jet valves for non-contact dispensing and screw valves for positive displacement applications, making it suitable for a wide range of fluid materials including UV glue, epoxy, silicone, underfill, silver conductive adhesive, and hot melt adhesives. The single-valve configuration accommodates cartridge capacities of 30ml, 50ml, 200ml, or 300ml, offering flexibility to match different production volumes and material requirements.

Smart Inline Conveyor System – The HP-D30-A integrates seamlessly with standard SMT production lines through its SMEMA-compatible interface, enabling easy communication with upstream and downstream equipment. The auto-adjustable track width ranges from 50mm to 510mm, accommodating diverse PCB panels and fixture sizes, while the conveyor height is set at 910±20mm for standard line compatibility. Flow direction is left-to-right as standard, with a right-to-left option available upon request.

Intelligent Control & Programming – The HP-D30-A offers an intuitive interface for rapid program creation. Operators can choose between teach pendant programming or keyboard and mouse operation for maximum flexibility when creating complex dispensing patterns including dots, lines, arcs, and circles. The online visual programming capability enables fast product changeovers with minimal downtime, and the system comes MES interface ready with open protocols for data readout, enabling seamless Industry 4.0 integration and real-time production monitoring.

Reliability & Maintenance – The system includes integrated vacuum cleaning for nozzle maintenance, ensuring consistent dispensing quality over extended production runs. A low-material alarm with liquid level sensing prevents dry-run conditions and unexpected production interruptions. The rugged, durable design is built for 24/7 continuous operation in demanding industrial environments.

Technical Specifications

The HP-D30-A is controlled by an industrial PC with a motion control card  and dedicated dispensing software. Programming is accomplished through teach pendant, keyboard, and mouse inputs, with visual programming support for ease of use. Communication is handled via a SMEMA interface for seamless line integration.

The dispensing travel range covers 450mm in the X axis, 460mm in the Y axis, and allows for a maximum component height of 50mm in the Z axis. The X and Y axes are driven by linear motors with optical encoders, while the Z axis utilizes a servo motor with a ground ballscrew. Maximum speeds are 1500mm/s for the X and Y axes and 300mm/s for the Z axis, with a repeat positioning accuracy of ±0.01mm.

The system supports either piezoelectric valves or screw valves in a single-valve configuration, with cartridge volumes available in 30ml, 50ml, 200ml, or 300ml sizes. The conveyor system features a height of 910±20mm, adjustable speeds ranging from 0.5 to 3.5 meters per minute, and an auto-adjustable track width spanning 50 to 510mm. Flow direction is left-to-right as standard.

The machine frame is constructed from cast iron for superior rigidity and vibration damping. An integrated vacuum suction cleaning system maintains nozzle performance, and an LED illumination assembly provides optimal workspace visibility.

Optional Upgrades

A range of optional features is available to extend the capabilities of the HP-D30-A. The MES system interface enables data readout for smart factory integration and real-time production analytics. A board support system with top-pin configuration prevents PCB flex during dispensing operations. The low-material alarm with liquid level sensing comes as standard, while an automatic wiping device is available for automated valve maintenance.

Additional options include laser height measurement for automatic Z-height compensation, which ensures consistent dispense gap across varying component heights. For increased throughput, dual-track or dual-section conveyor configurations are available, along with an electronic weighing module for real-time glue volume monitoring. A track bottom heating module provides thermal management for heat-sensitive fluids that require temperature control during processing.

Applications

The HP-D30-A serves a wide range of industries and applications. In consumer electronics, it is commonly used for smartphone camera module assembly, FPC reinforcement, and display bonding. The automotive electronics sector utilizes this platform for sensor encapsulation, PCB underfill, and connector sealing. Semiconductor packaging applications include underfill, dam-and-fill, POP packaging, and chip encapsulation. In LED manufacturing, the system handles phosphor coating and LED packaging, while medical device manufacturers rely on it for precision fluid application and assembly bonding.

Why Choose the HP-D30-A

The HP-D30-A delivers proven reliability through its cast-iron construction and linear motor design, ensuring long-term stability and minimal maintenance requirements. With speeds up to 1500mm/s, it significantly reduces production bottlenecks and lowers labor costs, delivering a high return on investment. The platform offers flexible deployment with support for multiple valve types and fluid materials, adapting easily to changing production needs. Industry 4.0 readiness is built in through the MES interface and SMEMA compatibility, enabling full line automation and real-time data monitoring. The Windows-based visual programming environment dramatically reduces training time and changeover complexity, allowing operators to become productive quickly and efficiently.

Get a Quote

Ready to upgrade your fluid dispensing process? Contact our sales team today for a customized solution tailored to your production requirements. The HP-D30-A high-speed automatic dispensing robot delivers the precision, speed, and reliability your SMT line demands. Reach out now to discuss your application and receive a competitive quote.