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Home > Products > Dispensing Machine > HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue Dispensing

HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue Dispensing

Product Details

Place of Origin: China

Brand Name: Haipai

Certification: CE,ISO9001

Model Number: HP-D30

Payment & Shipping Terms

Minimum Order Quantity: 1 unit

Packaging Details: Wooden case with vacuum package inside

Delivery Time: 30 working days

Payment Terms: T/T

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Highlight:

Piezoelectric Jet Dispensing Machine

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High Speed Jet Dispensing Machine

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Piezoelectric Glue Dispensing Machine

Piezoelectric Jet Technology:
H-Y01 Valve With Customizable Nozzle For Precision Non-contact Dispensing
Ultra-High Speed:
1000mm/s Maximum Movement For Maximum Throughput
Exceptional Precision:
±0.01mm Repeat Accuracy With Servo + Grinding Screw Drive
CCD Visual Positioning:
Automatic Calibration And Real-time Error Correction
Visual Programming:
Online Programming From Board Images For Simple, Fast Setup
Automatic Width Adjustment:
50-400mm Track Width With SMEMA Integration
Piezoelectric Jet Technology:
H-Y01 Valve With Customizable Nozzle For Precision Non-contact Dispensing
Ultra-High Speed:
1000mm/s Maximum Movement For Maximum Throughput
Exceptional Precision:
±0.01mm Repeat Accuracy With Servo + Grinding Screw Drive
CCD Visual Positioning:
Automatic Calibration And Real-time Error Correction
Visual Programming:
Online Programming From Board Images For Simple, Fast Setup
Automatic Width Adjustment:
50-400mm Track Width With SMEMA Integration
HP-D30 High Speed Piezoelectric Jet Dispensing Machine Underfill Red Glue Dispensing
High-Speed Piezoelectric Jet Dispensing Machine
The HP-D30 sets a new benchmark in high-speed dispensing, combining piezoelectric jet technology with precision motion control to achieve an extraordinary 1000mm/s maximum movement speed while maintaining ±0.01mm repeat accuracy. Powered by the H-Y01 piezoelectric jet valve with customizable nozzle impact pin, this system delivers non-contact dispensing with precise droplet control—eliminating Z-axis movement between dots and dramatically increasing throughput for underfill, encapsulation, and precision adhesive applications.
Technical Specifications
Model HP-D30
Machine Dimensions L990*W1350*H1600mm
Weight 1000kg
Control Method Industrial PC + Motion Control Card
Programming Online visual programming
CCD Vision Automatic calibration and error correction
X/Y/Z Drive Servo motor + precision grinding screw
Max Movement Speed 1000mm/s
Repeat Accuracy ±0.01mm
Dispensing Itinerary X=400mm, Y=400mm, Z=50mm
Component Height 50mm max
Dispensing Valve 1x H-Y01 piezoelectric jet valve
Material Capacity 30CC / 50CC
Track Width 50-400mm (automatic adjust)
Conveyor Speed 0.5-3.5m/min adjustable
Air Pressure 6.2kgf/cm²
Power Supply 220V 50-60Hz
Total Power 3KW
Interface SMEMA
Alarm System Menu display + sound/light alarm
Applications
  • Underfill for flip chips and BGAs
  • Precision adhesive dispensing
  • Encapsulation and dam & fill
  • Solder paste jetting
  • Thermal interface material application
  • Camera module assembly
  • MEMS and sensor packaging
  • High-precision electronics assembly