High-Precision Automatic Dispensing for PCB Assembly & Electronics Manufacturing

The HP-D30-B Automatic Dispensing Machine is a precision PCB dispensing machine designed for SMT, PCBA and electronics manufacturing applications. Featuring servo motor and precision ground ball screw drives, the system delivers stable motion control, ±0.02 mm repeatability, and up to 1000 mm/s moving speed for accurate and consistent adhesive dispensing.

Equipped with a piezoelectric jet dispensing valve, the HP-D30-B supports fast and precise non-contact dispensing, making it suitable for applications such as PCB adhesive dispensing, electronic component bonding, underfill dispensing, UV glue dispensing and precision fluid dispensing.

With online visual-assisted programming, CAD/DXF import, CCD positioning and SMEMA communication, the HP-D30-B can be integrated into automated SMT assembly lines and PCB production lines, providing a flexible solution for automated adhesive dispensing and electronics manufacturing.

Key Features

Precision Servo-Driven Dispensing System

The HP-D30-B uses servo motors and precision ground ball screws for stable and accurate X/Y/Z motion. With ±0.02 mm repeatability and speeds up to 1000 mm/s, it provides reliable positioning for high-precision PCB dispensing and adhesive dispensing applications.

Piezoelectric Jet Dispensing for Fast, Non-Contact Application

The standard H-Y01 piezoelectric jetting valve enables high-speed non-contact dispensing, helping achieve consistent micro-dot and precision adhesive deposits. The dispensing system can be used for UV adhesive, epoxy, silicone, underfill and other electronic assembly materials, depending on material characteristics and process requirements.

Automatic PCB Dispensing with CCD Vision

Integrated CCD visual positioning automatically calibrates and compensates for product positioning errors, improving dispensing accuracy across different PCB assemblies. This makes the machine suitable for automated PCB dispensing, SMT dispensing and precision adhesive dispensing.

Flexible Programming & CAD Import

The HP-D30-B supports online visual-assisted programming and CAD/DXF file import, allowing operators to quickly create and edit dispensing paths. The system can handle different dispensing patterns and positions for automated dot dispensing, precision adhesive application and PCB assembly.

Inline SMT & PCB Assembly Integration

With SMEMA communication, the HP-D30-B can be integrated into SMT production lines, PCB assembly lines and automated electronics manufacturing systems. Its adjustable conveyor width of 50–460 mm accommodates different PCB sizes and production requirements.

Stable Dispensing for Continuous Production

Vacuum nozzle cleaning helps maintain nozzle condition and dispensing consistency during continuous operation. Input air pressure alarms and material shortage alarms provide visual and audible warnings to reduce production interruptions and maintain stable dispensing process control.

Advanced PCB Dispensing & Automation

The HP-D30-B is designed for manufacturers looking to automate repetitive adhesive application processes while maintaining consistent dispensing quality.

Its combination of servo motion control, CCD vision positioning, piezoelectric jet dispensing and CAD-based programming makes it suitable for a wide range of PCB assembly and electronics manufacturing processes.

Typical applications include:

• PCB adhesive dispensing
• SMT dispensing
• PCBA dispensing
• Electronic component bonding
• UV glue dispensing
• Epoxy dispensing
• Silicone dispensing
• Underfill dispensing
• Precision micro-dot dispensing
• Non-contact jet dispensing
• Automated adhesive application

Applications

PCB Assembly & PCBA Manufacturing

The HP-D30-B provides automated and repeatable adhesive dispensing for PCB assembly, helping electronics manufacturers improve dispensing consistency, reduce manual operations and increase production efficiency.

SMT Production

With SMEMA-compatible inline integration, the machine can work with upstream and downstream SMT equipment for automated production line operation.

Electronic Component Bonding

The precision dispensing system is suitable for applying controlled amounts of adhesive to electronic components, PCB assemblies and other precision bonding applications.

UV Glue, Epoxy & Silicone Dispensing

Depending on material properties and valve configuration, the HP-D30-B can support different industrial dispensing materials used in electronics manufacturing and PCBA production.

Why Choose the HP-D30-B?

• ±0.02 mm repeatability for precision dispensing
• 1000 mm/s maximum moving speed
• Servo motor + precision ground ball screw motion system
• Piezoelectric jet dispensing valve
• Non-contact dispensing
• CCD vision positioning
• CAD/DXF program import
• Adjustable PCB conveyor: 50–460 mm
• SMEMA-compatible inline integration
• Vacuum nozzle cleaning
• Material shortage and air pressure alarms
• Designed for SMT, PCB assembly and electronics manufacturing