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HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System

Product Details

Place of Origin: China

Brand Name: Haipai

Certification: CE,ISO9001

Model Number: HP-IR3DS-6

Payment & Shipping Terms

Minimum Order Quantity: 1 unit

Packaging Details: Wooden case with vacuum package inside

Delivery Time: 30 working days

Payment Terms: T/T

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Double Layer Infrared Curing Ovens

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Double Layer IR Curing Ovens

Double-Layer Design:
6 Temperature Zones (3 Upper + 3 Lower) For Twice The Curing Capacity
6 Heating Tubes Per Zone:
Uniform Heat Distribution For Consistent Curing Results
Fast Warm-up:
<15 Minutes To Operating Temperature Minimizes Downtime
Thick Insulation:
Minimizes Heat Loss, Reduces Energy Consumption, And Prevents Ambient Temperature Rise
Electric Lid Opening:
Software-controlled For Easy Maintenance Access
Large Component Clearance:
±110mm For Assembled Boards With Tall Components
SMEMA Interface:
Seamless Integration With SMT Lines
Reinforced High-Temp Guide Rails:
Anti-vibration Support Prevents Track Shaking And Board Fall-off
Double-Layer Design:
6 Temperature Zones (3 Upper + 3 Lower) For Twice The Curing Capacity
6 Heating Tubes Per Zone:
Uniform Heat Distribution For Consistent Curing Results
Fast Warm-up:
<15 Minutes To Operating Temperature Minimizes Downtime
Thick Insulation:
Minimizes Heat Loss, Reduces Energy Consumption, And Prevents Ambient Temperature Rise
Electric Lid Opening:
Software-controlled For Easy Maintenance Access
Large Component Clearance:
±110mm For Assembled Boards With Tall Components
SMEMA Interface:
Seamless Integration With SMT Lines
Reinforced High-Temp Guide Rails:
Anti-vibration Support Prevents Track Shaking And Board Fall-off
HP-IR3DS-6 Double Layer Infrared Curing Oven Thermal Curing System
HP-IR3DS-6 Double-Layer Infrared Curing Oven
The HP-IR3DS-6 Double-Layer Infrared Curing Oven is an advanced thermal curing system engineered for high-volume SMT production environments requiring maximum throughput and precise temperature control.
System Overview
This innovative double-layer design features six independent temperature zones—three upper tracks and three lower tracks—effectively doubling curing capacity compared to single-layer systems while maintaining a compact footprint. The double-layer configuration allows manufacturers to process two separate PCB streams simultaneously, dramatically increasing production throughput without expanding floor space.
Key Features
  • Six independent temperature zones with PID control via touch screen interface
  • Precise thermal profiling from room temperature to 100°C
  • Six heating tubes per zone for uniform heat distribution
  • Double-layer design doubles curing capacity in same footprint
  • Rapid warm-up time under 15 minutes minimizes downtime
  • Energy-efficient design with thick insulation reduces power consumption
  • Durable T1.5 steel plate welded construction
Ideal for thermally-cured conformal coatings, adhesives, and encapsulants in high-volume SMT production environments.
Technical Specifications
Parameter Specification
Model HP-IR3DS-6
External Dimensions (L*W*H) L3000mm * W1080mm * H1300mm
Weight Approx. 580 kg
Control Method PLC + Touch Screen
PCB Transfer Height 910±20mm
Conveyor Speed 0.5-3.5m/min adjustable
Transfer Motor Stepper motor
Conveyor Type Chain conveyor (35B 5mm extended pin stainless steel chain)
PCB Width MAX: 450mm
Rail Width Adjustment Electrically adjustable, 50-450mm
Number of Temperature Zones 6 total (3 upper tracks + 3 lower tracks)
Heating Tubes per Zone 6 pieces
Temperature Control Range Room temperature - 100°C
Warm-up Time <15 minutes
Max PCB Size L450mm * W450mm
Component Clearance ±110mm max
Cover Opening Method Software control, electric lifting
Frame Construction T1.5 steel plate welded
Power Supply AC380V, 50Hz, 3-phase 5-wire
Total Power 19KW
Interface SMEMA