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Home > Products > Curing Ovens > HP-RF3C 3-Zone Hot Air Curing Ovens High Volume PCB Thermal Curing Oven

HP-RF3C 3-Zone Hot Air Curing Ovens High Volume PCB Thermal Curing Oven

Product Details

Place of Origin: China

Brand Name: Haipai

Certification: CE,ISO9001

Model Number: HP-RF3C

Payment & Shipping Terms

Minimum Order Quantity: 1 unit

Packaging Details: Wooden case with vacuum package inside

Delivery Time: 30 working days

Payment Terms: T/T

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Highlight:

3 Zone Curing Ovens

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Hot Air Curing Ovens

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PCB Thermal Curing Oven

3-Zone Independent Control:
Precise Thermal Profiling With Individual PID Control
Extended Furnace Length:
3000mm For Longer Curing Times Or Higher Throughput
Heating Elements + Hot Air Fans:
Uniform Heat Distribution For Consistent Curing Results
Fast Warm-up:
<10 Minutes To Operating Temperature Minimizes Downtime
Thick Insulation:
Minimizes Heat Loss, Reduces Energy Consumption (9.5KW Total), And Prevents Ambient Temperature Rise
Electric Lid Opening:
Software-controlled For Easy Maintenance Access
Large Component Clearance:
±110mm For Assembled Boards With Tall Components
Temperature Range:
Room Temperature To 120°C For Versatile Material Compatibility
3-Zone Independent Control:
Precise Thermal Profiling With Individual PID Control
Extended Furnace Length:
3000mm For Longer Curing Times Or Higher Throughput
Heating Elements + Hot Air Fans:
Uniform Heat Distribution For Consistent Curing Results
Fast Warm-up:
<10 Minutes To Operating Temperature Minimizes Downtime
Thick Insulation:
Minimizes Heat Loss, Reduces Energy Consumption (9.5KW Total), And Prevents Ambient Temperature Rise
Electric Lid Opening:
Software-controlled For Easy Maintenance Access
Large Component Clearance:
±110mm For Assembled Boards With Tall Components
Temperature Range:
Room Temperature To 120°C For Versatile Material Compatibility
HP-RF3C 3-Zone Hot Air Curing Ovens High Volume PCB Thermal Curing Oven
HP-RF3C 3-Zone Hot Air Curing Oven
High-Volume PCB Thermal Curing System
The HP-RF3C Hot Air Curing Oven is an advanced thermal curing system engineered for high-volume SMT production environments requiring extended curing times or higher throughput. With its 3000mm total length and three independent hot air temperature zones, this system provides superior flexibility for thermal profiling compared to shorter or fewer-zone models.
Advanced Three-Zone Thermal Control
The three-zone design enables sophisticated thermal profiles impossible with simpler systems:
  • Gradual preheat in Zone 1
  • Controlled soak in Zone 2
  • Final cure in Zone 3
This configuration optimizes results for materials requiring specific temperature ramps and dwell times. Each zone features independent PID temperature control integrated with the PLC + touch screen interface, enabling precise temperature settings from room temperature to 120°C.
Superior Heating Technology
The advanced heating system combines heating elements with hot air fans to achieve exceptional temperature uniformity across the entire curing chamber. Heating elements provide primary thermal energy, while forced hot air circulation ensures even distribution—eliminating hot spots and cold zones that can compromise curing quality. This combination is particularly effective for curing complex assemblies where uniform heat exposure is critical.
High-Throughput Performance
The extended 3000mm furnace body provides ample space for multi-stage thermal profiles at productive conveyor speeds up to 3.5m/min, or enables longer curing times at standard speeds for thick coatings and challenging materials. The <10 minute warm-up time minimizes downtime between production runs.
Technical Specifications
Model HP-RF3C
External Dimensions (L*W*H) L3000mm * W1080mm * H1300mm
Weight Approx. 530 kg
Control Method PLC + Touch Screen
PCB Transfer Height 910±20mm
Conveyor Speed 0.5-3.5m/min adjustable
Transfer Motor Stepper motor
Conveyor Type Chain conveyor (35B 5mm extended pin stainless steel chain)
PCB Width MAX: 450mm
Rail Width Adjustment Electrically adjustable, 50-450mm
Number of Temperature Zones 3 hot air temperature zones
Temperature Control Range Room temperature - 120°C
Warm-up Time <10 minutes
Max PCB Size L450mm * W450mm
Component Clearance ±110mm max
Cover Opening Method Software control, electric lifting
Heating System Heating elements + hot air fans
Frame Construction T1.5 steel plate welded
Power Supply AC380V, 50Hz, 3-phase 5-wire
Total Power 9.5KW
Interface SMEMA