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HP-740D 4 Axis Online Dispenser ±180° Rotating U Axis 2600ML Glue Supply For High Density PCBs

HP-740D 4 Axis Online Dispenser ±180° Rotating U Axis 2600ML Glue Supply For High Density PCBs

Brand Name: Haipai
Model Number: HP-740D
MOQ: 1 unit
Packaging Details: Wooden case with vacuum package inside
Payment Terms: T/T
Detail Information
Place of Origin:
China
Certification:
CE,ISO9001
4-Axis Motion (X, Y, Z, U):
±180° Rotating U-axis For Unprecedented Access To Complex Geometries
Adjustable Valve Tilt:
0-45° Manual Adjustment For Optimal Dispensing Positioning
High-Precision Motion:
Servo Motor + Screw Drive With ±0.02mm Repeatability At 800mm/s
Large-Volume Supply:
2600ML Glue System For Extended Production Runs
Shadow Effect Elimination:
Ensures Uniform Coverage On High-density Boards
Built-in UV Inspection:
Real-time Dispensing Verification
SMEMA Interface:
Seamless Integration With SMT Lines
Highlight:

4 Axis Online Dispenser

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PCB Online Dispenser

Product Description
HP-740D 4-Axis Online Dispenser with ±180° Rotating U-Axis
Advanced Four-Axis Dispensing System
The HP-740D Online Dispensing Machine is an advanced four-axis selective dispensing system engineered for the most demanding high-density PCB applications. Featuring a unique rotating U-axis powered by a servo motor + hollow rotating platform with ±180° rotation capability, this machine provides unprecedented access to complex board geometries that standard three-axis systems cannot reach.
Precision Dispensing Capabilities
The innovative four-axis design (X, Y, Z, U) enables precise selective dispensing around connectors, tall components, and other sensitive areas. The U-axis rotation allows the dispensing valve to approach components from optimal angles, ensuring complete material placement while maintaining tight edge definition. This capability is particularly valuable for boards with components on multiple planes, recessed areas, or undercuts where vertical-only access is insufficient.


  • tection light source
  • SMEMA interface for seamless integration into production lines
Technical Specifications
Parameter Specification
Model HP-740D
External Dimensions (L*W*H) L1060mm * W1300mm * H1700mm
Weight Approx. 500 kg
Control Method Industrial PC + Board Control
Programming Method Manual teaching + mouse/keyboard
PCB Transfer Height 910±20mm
Conveyor Speed 0.5-3.5 m/min adjustable
Conveyor Type Chain conveyor (35B 5mm extended pin belt with stainless steel chain guard)
Transfer Motor Dual stepper motors, independent control
Conveyor Rail Width 50-450mm adjustable
Component Clearance 100mm max
Rail Width Adjustment Drive Stepper motor drives dual ball screws
Rail Width Adjustment Method Electrical control
X.Y.Z Drive Mode Servo Motor + Screw Drive Module
X.Y Maximum Speed 800mm/s
Z Maximum Speed 300mm/s
XYZ Axis Repeatability ±0.02mm
U-Axis Drive Mode Servo motor + hollow rotating platform
U-Axis Rotation Angle ±180°
Valve Type 1x H-N02 silicone dispensing valve
Valve Tilt Adjustment 0-45° manual
Tank Capacity 2600ML glue supply system
Cleaning Function Built-in automatic cleaning
Lighting Built-in LED lighting
Inspection Built-in UV detection light source
Power Supply AC220V 50Hz
Air Supply 4-6 kgf/cm²
Total Power 1.8KW
Interface SMEMA



Industry Keywords Tag Cloud :


Core Equipment Terms: Automated Dispensing Machine, Fluid Dispensing Robot, Automatic Glue Dispenser, Selective Fluid Dispensing System, Inline Dispensing Machine, PCB Dispensing Equipment, PCBA Glue Dispenser, Tabletop Dispensing Robot, Dual-Component Dispensing System


Fluid Control Automation Processing & Technology Keywords: Precision Dispensing, Jet Dispensing, Needle Dispensing, Micro-Dispensing Technology, Potting Process, Encapsulation System, Underfill Dispensing, Dam and Fill, Silicone Sealing, Thermal Interface Material Application


Glue Volume Calibration Material Compatibility Keywords: Silicone Adhesive, Epoxy Resin, Polyurethane Glue, UV Curable Adhesive, Cyanoacrylate, Thermal Conductive Paste, Conductive Silver Epoxy, Two-Part Adhesive, Solvent-Free Glue, Protective Polymeric


Material Manufacturing & Application Keywords: PCB Assembly, SMT Production Line, Semiconductor Packaging, Electronics Manufacturing, LED Encapsulation, Automotive Electronics Assembly, Sensor Sealing, Camera Module Bonding, Smart Device Components Protection


Industrial Control Module Potting Performance & Inspection Keywords: High Precision Dispensing, Non-Contact Jetting, High-Speed Fluid Deposition, Dynamic Weight Calibration, Laser Height Sensor, Vision Alignment System, CCD Positioning, Automatic Nozzle Cleaning, Closed-Loop Fluid Control


Industry 4.0 Smart Dispensing Quality & Curing Keywords: Dispensing Quality Control, Glue Line Inspection, Automated Optical Inspection, Defect Detection, UV Curing Process, Thermal Curing Line, Process Verification, Quality Assurance, Turnkey Dispensing Solution, Smart Production Line Integration